Solders and soldering for hybird technology.

Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects

Lead-free soldering, originally started as an environmental issue, is evolving rapidly into a business survival tool for the worldwide electronic industry. Promising lead-free solder alternatives for surface mount assembly applications include eutectic Sn/Ag, eutectic Sn/Cu, Sn95/Sb5, eutectic Sn/Bi, Sn/Ag/Cu, Sn/Ag/Cu/X, Sn/Bi/Ag/X, Sn/Zn/X, and Sn/In/Ag/(X). However, for wafer level area arra...

Real Valued and Hybird Genetic Algorithms for Polypeptide Structure Prediction

Energy minimization e orts to predict polypeptide structures assume their native conformation corre sponds to the global minimum free energy state Given this assumption the problem becomes that of develop ing e cient global optimization techniques applicable to polypeptide energy models This general structure prediction objective is also known as the protein fold ing problem Our prediction algo...

0 Canonical Transformations and Soldering

We show that the recently developed soldering formalism in the Lagrangian approach and canonical transformations in the Hamiltonian approach are complementary. The examples of gauged chiral bosons in two dimensions and self-dual models in three dimensions are discussed in details.

Hybird Particle Swarm Optimizer with Mass Extinction

A hybrid particle swarm optimizer with mass extinction, which has been suggested to be an important mechanism for evolutionary progress in biological world, is presented to enhance the capacity in reaching optimal solution. The testing results of three benchmark functions that typically used in evolutionary optimization research indicate this method improves the performance effectively.

Reflow Soldering Guidelines for Surface - Mount Devices